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ChemLink BuildSecure is a moisture-curing polyether structural adhesive for panel-on-frame floors, walls, and roof decks. It fills irregular gaps without shrinking and can develop wood-tearing bonds in less than four hours at 72°F.

  • Wood-tearing bonds in less than 4 hours at 72°F
  • Zero-slump beads on vertical or overhead work
  • Solvent-free cartridges for occupied panel-on-frame work
$159.26
Drop Shipped

ChemLink BuildSecure Construction Adhesive, Panel on Frame Polyether

ChemLink BuildSecure is a fast-setting moisture-curing polyether structural adhesive for panel-on-frame floors, walls, and roof decks. The solvent-free, non-flammable formula fills irregular gaps without shrinking and can develop wood-tearing bonds in less than four hours at 72°F. Typical work includes subfloors, sheathing, shear walls, and SIPs. It is a zero-slump gun grade for horizontal, vertical, or overhead beads. Do not use on exterior surfaces.

Key Features

  • Fast-setting structural adhesive for panel-on-frame floors, walls, and roofs
  • Can develop wood-tearing bonds in less than four hours at 72°F
  • Solvent-free, non-flammable, and zero slump for vertical or overhead beads
  • Fills irregular gaps without shrinking
  • Bonds sheathing, SIPs, EPS foam, wood to metal, and cabinetry
  • Fixture with nails, screws, or staples until the adhesive sets
  • Do not use on exterior surfaces

Applications

  • Bonding conforming subfloor structures.
  • Roof and wall sheathing to wood and metal studs.
  • Shear wall construction and structural insulated panels (SIPs).
  • EPS foam insulation.
  • Wood to metal assemblies.
  • Cabinetry, sink tops, and carpet tack strip.

Technical Specifications

Property Value
Product BuildSecure Multi-Purpose Construction Adhesive
Color Tan
Packaging 10.1 oz (300 ml) cartridge, 24/carton
TDS DS1004, 04/21/21
Chemistry Moisture-curing polyether
ASTM C557 Conforms
VOC <15 g/L (ASTM D2369 / EPA 24)
Shear strength 411 to 460 psi (ASTM D1002)
Tack-free time 20 ± 10 min
Gun grade Zero slump
Density 11.6 ± 0.2 lbs/gal (ASTM D1475)
Service temperature -40 to 200°F (-40 to 93°C)
Application temperature 32 to 110°F (0 to 44°C)

Product documents: BuildSecure Multi-Purpose Construction Adhesive Technical Data Sheet DS1004 (PDF) | Safety Data Sheet - BuildSecure (PDF)

Frequently Asked Questions

Where is ChemLink BuildSecure used?
ChemLink BuildSecure is the structural adhesive for panel-on-frame floors, walls, and roof decks. Typical work includes subfloors, sheathing, shear walls, and SIPs.

How fast does ChemLink BuildSecure develop a wood-tearing bond?
ChemLink BuildSecure can develop wood-tearing bonds in less than four hours at 72°F.

What materials does ChemLink BuildSecure bond?
ChemLink BuildSecure bonds wood studs, galvanized steel framing, aluminum framing, rafters, subfloors, drywall, gypsum, stone, fiberglass, FRP panels, expanded polystyrene, and polyurethane foam.

Can ChemLink BuildSecure be used on exterior surfaces?
No. ChemLink publishes ChemLink BuildSecure for interior panel-on-frame work. Do not use it on exterior surfaces.

Does ChemLink BuildSecure shrink when it fills an irregular gap?
No. ChemLink BuildSecure is solvent-free and fills irregular gaps without shrinking.

Can ChemLink BuildSecure hold a bead on vertical or overhead work?
Yes. ChemLink BuildSecure is zero-slump for horizontal, vertical, or overhead beads.